Capabilities

The following table shows both current  and projected capabilities of our China Plants, Suzhou, Wuxi and Jiangsu. 


Capability

                     Current

              Future

Suzhou

Wuxi

Jiangsu

Suzhou

Wuxi

Jiangsu

Plant Capacity (Kilo SF/Month)

750

900

300

750

900

300

Layer Count (Layer)

2 ~ 14

2 ~ 20

2 ~ 20

2 ~ 20

2 ~ 20

2 ~ 20

Line Width/Spacing (mm)

0.1/0.1

0.05/0.05

0.05/0.05

0.1/0.1

0.04/0.04

0.04/0.04

Drill Size (mm)

Mechanical size Min (mm)

0.2

0.1

0.1

0.2

0.1

0.1

Laser size (mm)

N/A

0.075

0.075

N/A

0.05

0.05

Electrical Test Pitch (mm)

0.4

0.2

0.2

0.4

0.2

0.2

Board thickness  (mm)

        Min Thickness

2L

0.5

0.15

0.15

0.5

0.1

0.1

4L

0.5

0.3

0.3

0.5

0.25

0.25

Max Thickness

2.4

3

3

2.4

3

3

Board Finishing

OSP

Done at GT WX

Done at GT WX

ENIG

Done at GT WX

Done at GT WX

Selective ENIG

Done at GT WX

Done at GT WX

ENEPIG

Done at GT WX

Done at GT WX

Done at GT WX

Done at GT WX

Hard gold

Done at GT WX

Done at GT WX

Done at GT WX

Done at GT WX

Soft gold

Done at GT WX

Done at GT WX

Done at GT WX

Done at GT WX

Immersion Tin

Done at GT SZ

Done at GT SZ

Done at GT SZ

Done at GT SZ

Immersion silver

Done at GT WX

Done at GT WX

HASL & Lead free HASL

Sub-contract

Sub-contract

Sub-contract

Sub-contract

Sub-contract

Sub-contract

Material

Normal FR4 (Tg 135°C to 170°C)

Lead-Free FR4 (Tg 150°C to 170°C)

Halogen-Free FR4 (Tg 150°C to 170°C)

(IMS with Al or Cu)





BT Material (Tg 185°C)



High Frequency Material (Low Dk&Df FR4)



   


Polyimide



Special Process/Product

Controlled Impedance

Differential Impedance

Blind/Buried Via



Laser Via



Automotive



HDD/SDD



Regal / Rigid-Flex



Semi-Flex





IMS





LED



CMOS



     Cavity      





High Layer Count